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Friday, February 01, 2008

"MATERIALS: Polymer aims to streamline chip fabs"

A cheaper, quicker-curing polymer aims to lower the cost and improve the efficiency of fabricating semiconductors, according to researchers at the Rensselaer Polytechnic Institute. Working with materials experts at Polyset Company Inc. (Mechanicville, New York), the new formulation of polyset epoxy siloxane (PES) could enhance semiconductor performance for conventional photolithography, as well as ease the transition to nanoimprint lithography.
Text: http://www.eetimes.com/showArticle.jhtml?articleID=206101987